Wafer Backside Interconnect Structure Connected to TSVs

摘要

An integrated circuit structure includes a semiconductor substrate having a front surface and a back surface; a conductive via passing through the semiconductor substrate; and a metal feature on the back surface of the semiconductor substrate. The metal feature includes a metal pad overlying and contacting the conductive via, and a metal line over the conductive via. The metal line includes a dual damascene structure. The integrated circuit structure further includes a bump overlying the metal line.

主权项

1. An integrated circuit structure comprising:
a semiconductor substrate having a front surface and a back surface; a conductive via in the semiconductor substrate; a first metal feature extending from the back surface of the semiconductor substrate into the semiconductor substrate and contacting the conductive via; and a bump overlying and electrically connected to the first metal feature.