| 发明名称 |
ESCAPE ROUTES |
| 摘要 |
Methods of and devices for providing escaping routes for the flux and gases generated to move away from the solder joint in the process of solder joint formation. |
| 申请公布号 |
US2014312479(A1) |
申请公布日期 |
2014.10.23 |
| 申请号 |
US201414198399 |
申请日期 |
2014.03.05 |
| 申请人 |
Flextronics AP, LLC |
发明人 |
Lopez Omar Garcia;Ahumada Quintero Pedro Alejandro;Secada Enrique Avelar;Kurwa Murad;Gonzalez Juan Carlos |
| 分类号 |
H01L23/00 |
主分类号 |
H01L23/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A device comprising:
a. a computing chip physically coupled with a printed circuit board; and b. a fluid channel coupled with the computing chip, the printed circuit board, or a combination thereof allowing a fluid to come out. |
| 地址 |
Broomfield CO US |
