| 发明名称 |
PACKAGE FOR LIGHT EMITTING DEVICE, AND LIGHT EMITTING DEVICE |
| 摘要 |
A package for a light emitting device includes: a resin portion having a sidewall thereof; a first lead having a reflective layer containing silver, the first lead being embedded in the resin portion such that the reflective layer is exposed inside the sidewall; and a second lead having at least a part of a surface thereof exposed inside the sidewall, the second lead being embedded in the resin portion while being isolated from the first lead, wherein in the first lead, the reflective layer is provided spaced inward apart from a boundary between the first lead and the resin portion, and wherein a separating surface exposed between the boundary and the reflective layer is formed of a surface of metal containing silver in a smaller amount than that of the reflective layer. |
| 申请公布号 |
US2014312364(A1) |
申请公布日期 |
2014.10.23 |
| 申请号 |
US201414255315 |
申请日期 |
2014.04.17 |
| 申请人 |
NICHIA CORPORATION |
发明人 |
WAKAKI Takayoshi;TANAKA Hiroyuki |
| 分类号 |
H01L33/40;H01L33/62 |
主分类号 |
H01L33/40 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A package for a light emitting device comprising:
a resin portion having a sidewall; a first lead having a reflective layer containing silver, the first lead being embedded in the resin portion such that the reflective layer is exposed inside the sidewall; and a second lead having at least a part of a surface thereof exposed inside the sidewall, the second lead being embedded in the resin portion while being separated from the first lead, wherein in the first lead, the reflective layer is provided spaced inward apart from a boundary between the first lead and the resin portion, and wherein a separating surface exposed between the boundary and the reflective layer is formed of a surface of metal containing silver in a smaller amount than that of the reflective layer. |
| 地址 |
Anan-shi JP |
