发明名称 INTEGRATED METAL PRINTED CIRCUIT BOARD
摘要 <p>The present invention relates to an integrated metal printed circuit board. The integrated metal printed circuit board according to one embodiment of the present invention can include a metal substrate; and a flexible circuit substrate which includes a flexible insulating layer with at least parts stacked on the upper part of the metal substrate, a conductive pattern formed on at least one surface of the flexible insulating layer, and a coverlay protection layer attached to at least one surface of the flexible insulating layer having the conductive pattern.</p>
申请公布号 KR20140123826(A) 申请公布日期 2014.10.23
申请号 KR20130041163 申请日期 2013.04.15
申请人 LG INNOTEK CO., LTD. 发明人 KIM, EUN JIN;PARK, JEUNG OOK;YOON, SANG IN;IM, HYUN GU
分类号 H05K1/02;H05K7/20 主分类号 H05K1/02
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