发明名称 |
INTEGRATED METAL PRINTED CIRCUIT BOARD |
摘要 |
<p>The present invention relates to an integrated metal printed circuit board. The integrated metal printed circuit board according to one embodiment of the present invention can include a metal substrate; and a flexible circuit substrate which includes a flexible insulating layer with at least parts stacked on the upper part of the metal substrate, a conductive pattern formed on at least one surface of the flexible insulating layer, and a coverlay protection layer attached to at least one surface of the flexible insulating layer having the conductive pattern.</p> |
申请公布号 |
KR20140123826(A) |
申请公布日期 |
2014.10.23 |
申请号 |
KR20130041163 |
申请日期 |
2013.04.15 |
申请人 |
LG INNOTEK CO., LTD. |
发明人 |
KIM, EUN JIN;PARK, JEUNG OOK;YOON, SANG IN;IM, HYUN GU |
分类号 |
H05K1/02;H05K7/20 |
主分类号 |
H05K1/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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