| 摘要 |
PROBLEM TO BE SOLVED: To suppress cracking or chipping of the resin layer in a resin molding, when releasing a resin mold for mounting a light-emitting element from a mold for transfer molding.SOLUTION: A lead frame for mounting a light-emitting element where a plurality of unit mounting regions 10, each consisting of more than one leads spaced apart from each other, are arranged continuously at intervals in the vertical and horizontal directions includes a coupling part 11 coupling the plurality of unit mounting regions 10 in the vertical and horizontal directions, and a frame 12 surrounding an aggregation of a plurality of unit mounting regions 10 arranged continuously via the coupling parts 11. In the lead frame for mounting a light-emitting element, a predetermined part of the frame 12 serves as a first ejector pin abutting portion, and a part including at least one unit mounting region 10, included in the aggregation surrounded by the frame 12, serves as a continuous planar second ejector pin abutting portion 13. |
