发明名称 ELECTRICAL CIRCUIT BOARD TRACE PATTERN TO MINIMIZE CAPACITOR CRACKING AND IMPROVE RELIABILITY
摘要 A printed wiring board with a component connection pad, such as a solder pad, providing thermal stress compensation for a surface mount circuit component and method for making such a pad. The component connection pad includes opposed groups of multiple conductive fingers that are mutually connected at their far ends and separated at their near ends where they have surfaces for mounting a single surface mount circuit component.
申请公布号 US2014311791(A1) 申请公布日期 2014.10.23
申请号 US201414206750 申请日期 2014.03.12
申请人 HIQ SOLAR, INC. 发明人 WILLIS Andre P.
分类号 H05K1/02;H05K3/10 主分类号 H05K1/02
代理机构 代理人
主权项 1. An apparatus including a printed wiring board with a component connection pad providing thermal stress compensation for a surface mount circuit component, comprising: an electrically insulated printed wiring board substrate; and one or more electrically conductive wiring patterns printed on a surface of said substrate and including at least one pair of component connection pads for mounting a surface mount circuit component, wherein each one of said at least one pair of component connection pads comprises opposing first and second pluralities of conductive segments, each of which extend from respective distal ends toward respective opposing proximal ends,are mutually connected at said distal ends, andincludes at least first and second surfaces, respectively, at said proximal ends for mounting respective contacts of a single surface mount circuit component.
地址 SANTA CLARA CA US