主权项 |
1. An apparatus including a printed wiring board with a component connection pad providing thermal stress compensation for a surface mount circuit component, comprising:
an electrically insulated printed wiring board substrate; and one or more electrically conductive wiring patterns printed on a surface of said substrate and including at least one pair of component connection pads for mounting a surface mount circuit component, wherein each one of said at least one pair of component connection pads comprises opposing first and second pluralities of conductive segments, each of which
extend from respective distal ends toward respective opposing proximal ends,are mutually connected at said distal ends, andincludes at least first and second surfaces, respectively, at said proximal ends for mounting respective contacts of a single surface mount circuit component. |