| 摘要 |
<p>To provide a wafer-support pin capable of extending life span and improving the productivity of heat treatment by rationally setting the shape and the surface roughness of a tip part of a wafer-support pin supporting a semiconductor wafer horizontally during heat treatment of the wafer, as well as capable of stabilizing wafer quality and reducing production costs by stabilizing the wear of the tip part of the support pin to maintain a reduction in contact area and heat capacity of the tip part of the support pin for a long period of time and suppress the occurrence of slip defects in the wafer due to thermal stresses, and also to realize long-term, high-temperature continuous treatment. [Solution] A wafer support pin (7) for supporting a semiconductor wafer (W) horizontally during heat treatment of the wafer (W) by making contact with a plurality of positions on the reverse side of the wafer (W). The circumferential side surface of a tip part of the wafer support pin (7) is controlled to have a prescribed surface roughness.</p> |
