CONDUCTIVE FILM-FORMING COMPOSITION AND METHOD FOR PRODUCING CONDUCTIVE FILM USING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a conductive film-forming composition capable of forming a conductive film which has high conductivity and is excellent in adhesion to a substrate.SOLUTION: The conductive film-forming composition contains: copper oxide particles (A) having an average particle diameter of 10-500 nm; copper particles (B) having an average particle diameter of 100-1000 nm; a polyol compound (C) having two or more hydroxy groups in the molecule; and at least one solvent (D) selected from the group consisting of water and a water-soluble solvent. The ratio W:Wof the total mass Wof the copper oxide particles (A) to the total mass Wof the copper particles (B) is 1:3 to 3:1. The ratio W:Wof the total mass Wof the copper oxide particles (A) and the copper particles (B) to the total mass Wof the polyol compound (C) is 20:1 to 2:1.