DEPOSITION APPARATUS

摘要

A deposition apparatus includes: a deposition chamber; a deposition source in the deposition chamber; a film fixing portion configured to fix a film, provided with a deposition surface to which the deposition material is deposited; and a protection plate in the deposition chamber to prevent the deposition material from being deposited to side and upper walls in the deposition chamber so as to control the deposition material to be deposited only to a valid film formation area. A first opening sized to correspond to the valid film formation area of the deposition surface and at least one second opening formed in an external area of the valid film formation area are formed in the protection plate, and, when the deposition material is deposited to the deposition surface by the deposition source, the deposition material passed through the second opening forms an alignment mark on the deposition surface.

主权项

1. A deposition apparatus configured to deposit a deposition material on a film, the apparatus comprising:
a deposition chamber; a deposition source in the deposition chamber; a film fixing portion configured to fix a film, the film fixing portion including a deposition surface to which the deposition material is deposited; and a protection plate in the deposition chamber configured to prevent the deposition material from being deposited to side and upper walls in the deposition chamber, wherein a first opening sized to correspond to a valid film formation area on the deposition surface and at least one second opening formed in an external area of the valid film formation area are formed on the protection plate, and wherein the deposition material passing through the at least one second opening is configured to form an alignment mark on the deposition surface.