| 发明名称 |
METHOD FOR FABRICATING AN EMBEDDED PATTERN USING A TRANSFER-BASED IMPRINTING |
| 摘要 |
In a method for fabricating an embedded pattern using a transfer-based imprinting, an adhesive layer is formed on a substrate. The adhesive layer has a photo curable resin. A stamp having a protruded pattern is prepared. A thin-film layer is formed on an outer surface of the protruded pattern of the stamp. The stamp having the thin-film layer contact with the adhesive layer is pressed to selectively transfer the thin-film layer of the protruded pattern to the adhesive layer. Ultraviolet rays (UV) are irradiated to cure the adhesive layer. The stamp is removed. |
| 申请公布号 |
US2014311662(A1) |
申请公布日期 |
2014.10.23 |
| 申请号 |
US201414194084 |
申请日期 |
2014.02.28 |
| 申请人 |
KOREA INSTITUTE OF MACHINERY & MATERIALS |
发明人 |
CHOI Jun-Hyuk;LEE Eung-Sug;LEE Ji-Hye;JEONG Jun-ho;JUNG Joo-Yun;CHOI Dae-Guen;KIM Cheol-Hyeon |
| 分类号 |
B32B37/00 |
主分类号 |
B32B37/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method for fabricating an embedded pattern using a transfer-based imprinting, the method comprising:
forming an adhesive layer on a substrate, the adhesive layer having a photo curable resin; preparing a stamp having a protruded pattern, a thin-film layer being formed on an outer surface of the protruded pattern of the stamp; pressing the stamp having the thin-film layer contact with the adhesive layer, to selectively transfer the thin-film layer of the protruded pattern to the adhesive layer; irradiating ultraviolet rays (UV) to cure the adhesive layer; and removing the stamp. |
| 地址 |
Daejeon KR |
