| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing an electronic device capable of reducing conduction failures in a mounting destination in a small electronic device to be formed.SOLUTION: A method for manufacturing an electronic device includes the steps of: preparing a package 12 including a recess 32 which opens on one side, a connection electrode 16 arranged on a bottom surface of the recess 32, and an external electrode 28 arranged on an upper surface of the recess 32, connecting an integrated circuit 50 to the connection electrode 16 and housing it in the recess 32, and sealing an active surface 52 of the integrated circuit 50 and the connection electrode 16 with a resin 58 (resin sealing step); and irradiating the external electrode 28 with plasma after the resin sealing step (plasma irradiation step). |
