| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a method of manufacturing an ink discharge head that can increase the film thickness of an ink layer and suppresses peeling of the nozzle layer from a substrate.SOLUTION: A method of manufacturing an ink discharge head includes: a lower ink flow passage wall formation process of forming, on one surface of a substrate where an energy generation element is provided, a sacrifice layer as an ink flow passage and a lower ink flow passage wall as a lower side wall part 16 of an ink chamber so that first resist surrounds a side wall part of the sacrifice layer up to an upper end part or a lower side rather than the upper end part; a lower side wall part formation process of forming a lower side wall part of the ink chamber by exposing and developing the lower ink flow passage wall; an ink chamber formation process of forming an ink flow passage wall, defining an ink chamber 3 with the lower side wall part, over the lower side wall part and sacrifice layer so that second resist surrounds the sacrifice layer, and also forming a nozzle layer over the sacrifice layer; and a nozzle formation process of forming a nozzle 2 discharging ink to the ink chamber and nozzle layer by exposing and developing the ink flow passage wall and nozzle layer 18.</p> |
