| 发明名称 |
SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE |
| 摘要 |
In a method of manufacturing a semiconductor device, a molding die for molding a resin case for a semiconductor device is prepared such that the molding die has protrusions to fix each of a plurality of terminals having a leg portion in a predetermined position. Each of the plurality of terminals is held to the corresponding protrusions in the molding die, and resin is injected into the molding die to integrally mold the plurality of terminals and the resin case. |
| 申请公布号 |
US2014312464(A1) |
申请公布日期 |
2014.10.23 |
| 申请号 |
US201414251036 |
申请日期 |
2014.04.11 |
| 申请人 |
FUJI ELECTRIC CO., LTD. |
发明人 |
ONISHI Kazunaga;MARUYAMA Rikihiro;TEZUKA Masafumi;KIKUCHI Masahiro |
| 分类号 |
H01L21/56;H01L23/544 |
主分类号 |
H01L21/56 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method of manufacturing a semiconductor device, comprising:
preparing a molding die for molding a resin case for a semiconductor device, the molding die having protrusions to fix each of a plurality of terminals having a leg portion in a predetermined position; conforming and holding each of the plurality of terminals to the corresponding protrusions in the molding die; and injecting resin into the molding die to integrally mold the plurality of terminals and the resin case. |
| 地址 |
Kawasaki-shi JP |
