PACKAGING SUBSTRATE AND PACKAGING STRUCTURE FOR LIGHT-EMITTING DIODE AND MANUFACTURING METHOD THEREFOR

摘要

A packaging substrate for a light-emitting diode, comprising at least: a substrate body (101) which has a first surface on which at least one unit is distributed, each of the units corresponding to a core grain of the light-emitting diode and having a first area and a second area which are electrically insulated from each other; and a groove structure (106) which is located between the two areas, the width of an opening at the top thereof being smaller than the width of the core grain to be packaged. The present invention can solve the problem that subsequent substrate removing and surface roughening cannot be conducted on a light-emitting diode due to the fact that a bottom layer cannot be filled with an adhesive material because the distance between a chip and a substrate is too small.