HEAT-REACTIVE RESIST MATERIAL, MOLD MANUFACTURING METHOD, MOLD, DEVELOPMENT METHOD AND PATTERN FORMATION MATERIAL

摘要

A heat-reactive resist material contains copper oxide, and silicon or silicon oxide, and is formed so that the content of silicon or silicon oxide in the heat-reactive resist material is 4.0 mol % or more less than 10.0 mol % in terms of mole of silicon. A heat-reactive resist layer is formed using the heat-reactive resist material, is exposed, and then, is developed with a developing solution. Using the obtained heat-reactive resist layer as a mask, dry etching is performed on a substrate with a fluorocarbon to manufacture a mold having a concavo-convex shape on the substrate surface. At this point, it is possible to control a fine pattern comprised of the concavo-convex shape.

主权项

1. A heat-reactive resist material containing copper oxide, and silicon or silicon oxide,
wherein a content of the silicon or the silicon oxide in the heat-reactive resist material is 4.0 mol % or more to less than 10.0 mol % in terms of mole of silicon.