| 摘要 |
The present invention relates to a flexible chip on film. The chip on film includes a base insulation layer, a metal layer which is formed on the upper side of the base insulation layer and includes a circuit pattern, an integrated circuit chip which is arranged on the upper side of the metal layer and is electrically connected to the metal layer, a solder resist layer which is formed on the metal layer to be insulated from the integrated circuit chip, and a reinforcement layer which is formed on the upper side of the solder resistive layer. A neutral surface where the vector sum of compressive power and tension in the bending state of the chip on film is zero is formed on the metal layer. |
