发明名称 SUBSTRATE LIQUID PROCESSING METHOD, SUBSTRATE LIQUID PROCESSING APPARATUS, AND STORAGE MEDIUM
摘要 PROBLEM TO BE SOLVED: To cover the entire surface of a substrate with a process liquid while reducing the supply amount of the process liquid.SOLUTION: A substrate liquid processing method includes the steps of: supplying a process liquid through a first nozzle (30) to the center of a surface of a substrate (W) while rotating the substrate around a vertical axis line in a horizontal posture, and forming a liquid film of the process liquid on the surface of the substrate, the liquid film having a diameter smaller than that of the substrate; supplying a process liquid, which is the same with the process liquid supplied through the first nozzle, through a second nozzle (33) to a peripheral part of the liquid film of the process liquid having been formed on the surface of the substrate through the first nozzle; and thereafter moving the supply position of the process liquid supplied through the second nozzle to the surface of the substrate toward a peripheral part of the substrate, thereby expanding the liquid film of the process liquid toward the peripheral part of the substrate.
申请公布号 JP2014199917(A) 申请公布日期 2014.10.23
申请号 JP20140008085 申请日期 2014.01.20
申请人 TOKYO ELECTRON LTD 发明人 ORII TAKEHIKO;SHINDO NAOKI
分类号 H01L21/304;H01L21/306 主分类号 H01L21/304
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