PACKAGE PROCESS

摘要

A package structure and a package process are provided. The package structure comprises a carrier having a carrying portion and a plurality of supporting bar remnants disposed around and extending outward from the carrying portion, a chip mounted to the carrying portion, and an encapsulant disposed on the carrier and covering the chip, wherein the supporting bar remnants are encapsulated by the encapsulant, and each of the supporting bar remnants has a distal end shrank from an outer surface of the encapsulant. A package process for fabricating the package structure is also provided.

主权项

1. A package process, comprising:
providing a carrier, wherein the carrier comprises:
a carrying portion;a side rail surrounding the carrying portion; anda plurality of supporting bar, each of the supporting bars connecting the carrying portion to the side rail and having a notch; mounting a chip to the carrying portion of the carrier; forming an encapsulant on the carrier to cover the chip and encapsulate an inner portion of each of the supporting bars and the notch located on the inner portion, an outer portion of each of the supporting bars being exposed by the encapsulant; applying a tensile force to the outer portion of each of the supporting bars to form a breaking point on the notch of each of the supporting bars; and removing the side rail from the breaking point of each of the supporting bars, wherein a plurality of supporting bar remnants remain in the encapsulant, and each of the supporting bar remnants has a distal end shrunk from an outer surface of the encapsulant.