发明名称 LED DISPLAY AND MANUFACTURING METHOD THEREOF
摘要 A manufacturing method of a LED display is provided. A temporary substrate is provided, wherein the temporary substrate has a first adhesive layer and a plurality of first, second and third LED chips mounted on the first adhesive layer. A first transparent substrate is provided, the transparent substrate has a plurality of pixels disposed thereon, and each of the pixels comprises a first sub-pixel, a second sub-pixel and a third sub-pixel respectively surrounded by a light-insulating structure. Then, the temporary substrate and the first transparent substrate are bonded together, such that each of the first, second and third LED chips is correspondingly mounted in each of the first sub-pixels, the second sub-pixels and the third sub-pixels. After that, the temporary substrate is removed. A LED display manufactured by said method is also provided.
申请公布号 US2014312368(A1) 申请公布日期 2014.10.23
申请号 US201414219035 申请日期 2014.03.19
申请人 Lextar Electronics Corporation 发明人 Lee Chia-En;Hou Chia-Hung
分类号 H01L33/00;H01L33/50;H01L27/15 主分类号 H01L33/00
代理机构 代理人
主权项 1. A manufacturing method of a light emitting diode (LED) display, comprising: providing a temporary substrate having a first adhesive layer and a plurality of first, second and third LED chips mounted on the first adhesive layer; providing a first transparent substrate having a plurality of pixels disposed thereon, wherein each of the pixels comprises a first sub-pixel, a second sub-pixel and a third sub-pixel respectively surrounded by a light-insulating structure; bonding the temporary substrate to the first transparent substrate, such that each of the first, second and third LED chips is correspondingly mounted in each of the first sub-pixels, second sub-pixels and third sub-pixels; and removing the temporary substrate.
地址 Hsinchu TW