MULTI-LAYER WIRING BOARD AND METHOD OF MANUFACTURING THE SAME

摘要

A multi-layer wiring board is configured having stacked therein, in a stacking direction, via an adhesive layer, a plurality of printed wiring bases in each of which a wiring pattern and a via are formed on/in a resin base. A multi-layer wiring board includes a movable portion configured from an elastic member and a void portion, the movable portion being formed in the printed wiring bases and adhesive layer in a periphery of a matrix-shaped plurality of multi-layer wiring portions disposed at a certain interval as viewed in a planar manner, and the movable portion joining the plurality of multi-layer wiring portions such that each of the multi-layer wiring portions is displaceable in the stacking direction and a direction of surfaces of the printed wiring bases.

主权项

1. A multi-layer wiring board configured having stacked therein, in a stacking direction, via an adhesive layer, a plurality of printed wiring bases in each of which a wiring pattern and a via are formed on/in a resin base, the multi-layer wiring board including:
a plurality of multi-layer wiring portions disposed in a matrix; and a movable portion configured from an elastic member, the movable portion joining the plurality of multi-layer wiring portions in a crisscross manner.