| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To suppress the formation of heat spots on a surface of a housing without affecting component mounting of a substrate. <P>SOLUTION: An electronic apparatus has a substrate 4 on which a heating component 3 is mounted, a housing 2 in which the substrate 4 is housed, and a heat transfer suppression structure 12 which is provided on the inner surface of the housing 2, has a frame, and accumulates a gas, thereby suppressing heat transfer to a surface of the housing 2 due to heat convection caused by the heating component 3 generating heat. <P>COPYRIGHT: (C)2012,JPO&INPIT</p> |
