PRINTED CIRCUIT BOARD HAVING HEAT SINK STRUCTURE,申请号KR20130032899-传众专利搜索

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发明名称	PRINTED CIRCUIT BOARD HAVING HEAT SINK STRUCTURE
摘要
申请公布号	KR101451568(B1)	申请公布日期	2014.10.22
申请号	KR20130032899	申请日期	2013.03.27
申请人		发明人
分类号	H05K1/02;H05K7/20	主分类号	H05K1/02
代理机构		代理人
主权项
地址

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