| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a molten solder plating wire capable of further reducing an immersion time into a solder plating tank when manufacturing a soft copper wire, and realizing further enhancement of a plating line speed, compared with the case when using oxygen free copper (OFC). <P>SOLUTION: The method for manufacturing the molten solder plating wire comprises: a step of applying a wire drawing process on a final wire diameter to a thin copper alloy material containing sulfur of 2-12 massppm, oxygen of more than 2 and not more than 30 massppm, and titanium of 4-55 massppm in pure copper containing inevitable impurities, and producing a wire drawing material; and a molten solder plating step of forming a molten solder plating layer on the surface of the wire drawing material by immersing the wire drawing material into the molten solder plating tank. The wire drawing material is altered to a soft copper wire depending on a heating value of the molten solder plating process. <P>COPYRIGHT: (C)2012,JPO&INPIT</p> |
