| 发明名称 |
METHOD FOR ENCAPSULATING AN ELECTRONIC ARRANGEMENT |
| 摘要 |
<p>The present invention relates to as method of encapsulating an electronic arrangement with respect to permeants, in which a pressure-sensitive adhesive based on acid-modified or acid-anhydride-modified vinylaromatic block copolymers is provided and in which the pressure-sensitive adhesive is applied to and/or around the regions of the electronic arrangement that are to be encapsulated.</p> |
| 申请公布号 |
EP2465150(B1) |
申请公布日期 |
2014.10.22 |
| 申请号 |
EP20100739598 |
申请日期 |
2010.07.30 |
| 申请人 |
TESA SE |
发明人 |
STEEN, ALEXANDER;KRAWINKEL, THORSTEN;KEITE-TELGENBÜSCHER, KLAUS;ELLINGER, JAN |
| 分类号 |
H01L51/52;C09J7/00;C09J7/02;C09J153/02 |
主分类号 |
H01L51/52 |
| 代理机构 |
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