| 摘要 |
The present invention relates to an image pattern forming method and a method for manufacturing a multi-layered PCB including the same and, more specifically, to an image pattern forming method and a method for manufacturing amulti-layered PCB including the same capable of smoothly completing a fine image pattern on a PCB substrate, and preventing twisting and improving flatness in the manufacture of a multi-layered PCB, and a method for manufacturing a multi-layered PCB including the same. According to the present invention, the image pattern forming method and the method for manufacturing a multi-layered PCB including the same comprise an etching process (S100) of coating, with an image film (60), a substrate (10) with copper foil (40) formed thereon, where an insulator is coated with copper, and partially fusing the copper foil (40) to expose the insulator, thereby forming an image pattern (20); a fine image pattern process (S200) of irradiating the image pattern (20) remaining on the substrate (10) with a laser beam (30) through the etching process (S100) such that the area of the image pattern (20) can be partially 10 to 30μm; and a separation process (S300) of completely removing the image film (60) and other residues except the image pattern (20) formed on the substrate (10) through the fine image pattern process (S200). |
