| 摘要 |
<P>PROBLEM TO BE SOLVED: To obtain low-shrinkable resin film having a low shrinkage even by reheating when sticking, and to improve heat adhesive property. <P>SOLUTION: In a method of a low-shrinkable resin film, the resin film 47 wherein a film-like resin material 15 for a sealing film extrusion-molded from a die 39 is moved to develop on a sheet substrate 11 fed out, is melted on the sheet substrate 11 by heating the film-like resin material 15 with the sheet substrate 11 together, and the film-like resin material 15 on the sheet substrate 11 is cooled after being pressurized with an emboss roller 21 and integrally laminated with the sheet substrate 11, is formed and the low-shrinkable resin film 49 comprising the sheet substrate 11 and the resin film 47 is taken up. The sheet substrate 11 fed out is supported on an endless conveying belt 37 and supported on a conveying belt 37. The film-like resin material 15 on the sheet substrate 11 can be melted by being heated with the conveying belt 37 together. <P>COPYRIGHT: (C)2011,JPO&INPIT |
