发明名称 パッケージ及びパッケージの製造方法
摘要 <p>Provided are a package and a method of manufacturing the package capable of suppressing corrosion of a bonding material and providing excellent airtightness, and to provide a piezoelectric vibrator, an oscillator, an electronic apparatus, and a radio-controlled timepiece. A bonding material formed on a front surface of a base substrate is anodically bonded to a frame region of a lid substrate. On the outer surface of a package, a protection film made of a material having higher resistance to corrosion than the bonding material is formed so as to cover at least the bonding material exposed between the base substrate and the lid substrate.</p>
申请公布号 JP5611615(B2) 申请公布日期 2014.10.22
申请号 JP20100033928 申请日期 2010.02.18
申请人 发明人
分类号 H03H9/02;H01L23/00;H01L23/02;H01L23/08;H03B5/32;H03H3/02 主分类号 H03H9/02
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