发明名称 MULTILAYER ELECTRONIC STRUCTURE WITH STEPPED HOLES
摘要 <p>The present invention relates to a multilayer electronic structure which comprises multiple layers extended from an X-Y plane; a dielectric enclosing a metal via post conducting electricity in a Z direction vertical to the X-Y plane; and one or more multilayer holes crossing two or more multiple layers. Two or more holes are included in an adjacent layer of the multilayer electronic structure and have different sizes on the X-Y plane. The adjacent part of the holes in the adjacent layer has a step shape, and one or more hole layers are on the surface of the multilayer electronic structure.</p>
申请公布号 KR20140123466(A) 申请公布日期 2014.10.22
申请号 KR20140124960 申请日期 2014.09.19
申请人 ACCESS ADVANCED CHIP CARRIERS AND E-SUBSTRATE SOLUTIONS 发明人 DROR HURWITZ;SIMON CHAN;ALEX HUANG
分类号 H05K3/46;H01L21/60;H01L23/12 主分类号 H05K3/46
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