发明名称 SILVER-COATED COPPER ALLOY POWDER AND METHOD FOR MANUFACTURING SAME
摘要 <p>A silver-coated copper alloy powder, which has a low volume resistivity and excellent storage stability (reliability), is produced by coating a copper alloy powder, which has a chemical composition comprising 1 to 50 wt% of at least one of nickel and zinc and the balance being copper and unavoidable impurities (preferably a copper alloy powder wherein a particle diameter (D 50 diameter) corresponding to 50% of accumulation in cumulative distribution of the copper alloy powder, which is measured by a laser diffraction particle size analyzer, is 0.1 to 15 µm), with 7 to 50 wt% of a silver containing layer, preferably a layer of silver or an silver compound.</p>
申请公布号 KR20140123526(A) 申请公布日期 2014.10.22
申请号 KR20147022463 申请日期 2013.01.15
申请人 DOWA ELECTRONICS MATERIALS CO., LTD. 发明人 INOUE KENICHI;OGI KOZO;EBARA ATSUSHI;HIYAMA YUTO;YAMADA TAKAHIRO;UEYAMA TOSHIHIKO
分类号 B22F1/02;C22C9/00;H01B1/22 主分类号 B22F1/02
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