POWER MODULE SUBSTRATE, SUBSTRATE FOR POWER MODULE WITH HEAT SINK, POWER MODULE, PASTE FOR FORMING FLUX COMPONENT PENETRATION PREVENTION LAYER, AND BONDING METHOD FOR ARTICLE TO BE BONDED

摘要

In a power module substrate 10, a circuit layer 12 is formed on one surface of an insulating layer 11, a metal layer 13 is formed on the other surface of the insulating layer 11, and a body to be bonded can be bonded to the other surface of the metal layer 13 using a flux. A flux component intrusion-preventing layer 51 containing an oxide and a resin is formed at a circumferential edge section of a bonding interface between the insulating layer 11 and the metal layer 13.