发明名称 部品内蔵樹脂基板およびその製造方法
摘要 <p>A component-embedded resin substrate (1) includes a plurality of resin layers (2) made of a first resin and laminated on one another, and a component (3) arranged to be surrounded by each resin layer (2) in a first group (8) which is a group of two or more resin layers arranged successively in a thickness direction included in the plurality of resin layers (2). An auxiliary resin portion (9) made of a second resin different from the first resin is arranged to be in contact with and along at least one of surfaces of the component (3).</p>
申请公布号 JP5610064(B2) 申请公布日期 2014.10.22
申请号 JP20130508818 申请日期 2012.03.27
申请人 发明人
分类号 H05K3/46;H05K1/18 主分类号 H05K3/46
代理机构 代理人
主权项
地址