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发明名称
研磨スラリー組成物
摘要
<p>Provided is a polishing slurry composition, including a non-ionic surfactant represented by the following formula (1) R-(OCH2CH2)x-OH formula (1) wherein x is an integer from 1 to 50.</p>
申请公布号
JP5613283(B2)
申请公布日期
2014.10.22
申请号
JP20130082334
申请日期
2013.04.10
申请人
发明人
分类号
H01L21/304;B24B37/00;C09K3/14
主分类号
H01L21/304
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代理人
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