| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a circuit board device capable of realizing double-faced mounting of heating components while keeping heat dissipation performance by using a metal body. <P>SOLUTION: A circuit board device in which heat of heating components 2 and 20 mounted on a surface of a circuit board 15 is transmitted to a heat dissipation member 120 via a metal body 30 embedded in a main body of the circuit board 15, the device comprises: the metal body 30 including extending portions 30a and 30b respectively extended from both sides of portions bonded to electrodes 7 and 70 to the outside; and the heat dissipation member 120 including a recess portion 122 on a surface on which the circuit board 15 is attached, in which the heat dissipation member 120 is attached to the circuit board 15 in such a manner that flat surfaces 121 other than the recess portion 122 of the member are thermally bonded to the extending portions 30a and 30b, respectively, so that the heating component 20 on a back side of the circuit board 15 can be stored in a space S formed by the recess portion 122 on the back side of the circuit board 15 and an opposite side from the heating component 2. <P>COPYRIGHT: (C)2012,JPO&INPIT</p> |
