发明名称 GATE ROUNDING FOR REDUCED TRANSISTOR LEAKAGE CURRENT
摘要 <p>Gate-rounding fabrication techniques can be implemented to increase an effective channel length of a transistor and to consequently reduce the leakage current and static power consumption associated with the transistor. The transistor comprises a substrate region that includes a source region and a drain region. The transistor can also comprise a gate region that includes a main gate portion, one or more gate tips, and one or more corresponding gate-rounded portions. Each of the one or more gate tips is formed at a suitable position along the side of the main gate portion. During fabrication, the junction between the main gate region and each of the gate tips takes on a rounded shape to form a corresponding gate-rounded region. The gate-rounded regions increase the average length of the gate region and the effective channel length of the transistor.</p>
申请公布号 EP2791974(A1) 申请公布日期 2014.10.22
申请号 EP20110877284 申请日期 2011.12.14
申请人 QUALCOMM INCORPORATED 发明人 CAI, YANFEI;LI, JI
分类号 H01L29/78;H01L21/28;H01L21/336;H01L27/088;H01L29/423;H01L29/49 主分类号 H01L29/78
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