| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a white photosensitive resin composition which has photosensitivity allowing microfabrication and provides a cured film excellent in reflectivity, flexibility, and nonflammability having only small warpage of a substrate after curing and only small reflectivity/hue change after high-temperature thermal history or photoirradiation, as well as to provide a resin film, an insulator film, a printed wiring board including the insulator film. <P>SOLUTION: A white photosensitive resin composition is used which substantially does not contain a silicon-containing organic compound but contains at least (A) a hydroxy group-containing resin having a specific structure which substantially does not contain a radical polymerizable group in a molecule, (B) a carboxyl group-containing resin which contains a radical polymerizable group in a molecule, (C) a radical polymerizable compound, (D) a reactive group-containing compound reactive with hydroxy groups which substantially does not contain an aromatic ring in a molecule, (E) a photoinitiator, (F) rutile-type titanium dioxide, and (G) a phosphinate. <P>COPYRIGHT: (C)2012,JPO&INPIT |
