| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a screen printing machine showing high transferability of solder to a circuit board irrespectively of the size of an electronic component. <P>SOLUTION: The screen printing machine 1 includes an inertial force-generating device 4 integrally giving inertial force to the circuit board B after solder printing and a screen mask 301 approximately contacting the circuit board B before plate removal in the lamination direction of the circuit board B and the screen mask 301 to improve transferability of the solder to the circuit board B. The inertial force given by the inertial force-generating device 4 pushes the solder to the circuit board B. Therefore the solder is fixed to the circuit board B. Accordingly the transferability of the solder to the circuit board B is improved irrespectively of the size of the electronic component. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
