METHOD FOR MANUFACTURING FLEXIBLE PRINTED CIRCUIT BOARD, AND FLEXIBLE PRINTED CIRCUIT BOARD MANUFACTURED BY THE METHOD

摘要

The present invention relates to a method to manufacture a flexible printed circuit board and a flexible printed circuit board manufactured by the same. A circuit pattern is formed of conductive paste on one side of a base material after heating the base material to be transformed by heat and hardened. Therefore, the stability of a size can be obtained when the printed circuit pattern is hardened by the conductive paste. Moreover, an adhesion force between the circuit pattern and the base material is prevented from deteriorating due to the deformation of a film when the circuit pattern is hardened. The adhesion force of the circuit pattern can stably be maintained after hardening.