Printed wiring board, build-up multi-layer board, and production method therefor

摘要

A multi-layer printed-wiring-board is used in densely packaging electronic components such as semiconductors having improved function, and a production method therefor, and more specifically it achieves a multi-layer printed-wiring-board having excellent copper-foil-peel-strength and high connection-reliability in which occurrence of structural defects such as delamination (interlayer peeling) is prevented, and a production method therefor. Because of thinning of the printed-wiring-board or diversification of insulating layers constituting the printed-wiring-board, peeling such as delamination may occur between the insulating layers or in an interface between the insulating layer and the plated conductor. By providing pores in substantially the same plane as wiring patterns in the printed-wiring-board including insulating layers, wiring pattern layers made of copper foil alternately laminated on the insulating layers, and pores provided between the wiring patterns, a printed-wiring-board having high connection reliability free from delamination or cracks during heating or in heat cycle conditions.

主权项

1. A printed wiring board comprising:
a first insulating layer; a second insulating layer; wiring patterns made of copper foil, which are alternately laminated on the first and the second insulating layers; and a resin-filled layer provided only at a side of the first insulating layer between the wiring patterns, wherein the first and the second insulating layers include at least resin, glass woven fabric and/or nonwoven fabric, and inorganic filler whose content is 30 vol. % or more and 70 vol. % or less with respect to the insulating layer, the inorganic filler has solubility with respect to an acid solution of more than pH5 or alkaline solution of less than pH10, the inorganic filler includes at least one material selected from aluminum hydroxide, silicon nitride, tin oxide, zirconium silicate, magnesium hydroxide, magnesium carbonate, calcium carbonate, calcium hydroxide, barium carbonate, and barium hydroxide, and the resin-filled layer includes a plurality of pores formed at the side of the first insulating layer and a resin product formed by filling the pores with resin of the second resin layer.