| 发明名称 |
Lid attach process |
| 摘要 |
Various methods of attaching a lid to an integrated circuit substrate are provided. In one aspect, a method of attaching a lid to a substrate that has an integrated circuit positioned thereon is provided. An adhesive is applied to the substrate and an indium film is applied to the integrated circuit. The lid is positioned on the adhesive. The adhesive is partially hardened and the indium film is reflowed. The adhesive is cured. |
| 申请公布号 |
US8865527(B2) |
申请公布日期 |
2014.10.21 |
| 申请号 |
US201313952392 |
申请日期 |
2013.07.26 |
| 申请人 |
Advanced Micro Devices, Inc. |
发明人 |
Too Seah Sun;Touzelbaev Maxat;Kirkland Janet |
| 分类号 |
H01L21/00;H01L21/50;H01L23/10;H01L23/42;H01L23/00 |
主分类号 |
H01L21/00 |
| 代理机构 |
|
代理人 |
Honeycutt Timothy M. |
| 主权项 |
1. A method of attaching a lid to a substrate having an integrated circuit positioned thereon, comprising:
applying an adhesive to the substrate; applying an indium film to the integrated circuit; positioning the lid on the adhesive; partially hardening the adhesive while applying a compressive force to the lid; reflowing the indium film without applying a compressive force to the lid; and curing the adhesive without applying a compressive force to the lid. |
| 地址 |
Sunnyvale CA US |
