发明名称 Radio-communication antenna device
摘要 An antenna device comprises an antenna board, wherein an antenna pattern is formed in or on a front surface of a dielectric layer, a ground layer is formed in or on a rear surface of the dielectric layer, and a feed pin is inserted into a thickness of the antenna board through the ground layer and the dielectric layer. The diameter of the antenna pattern is set to one half of the wavelength of an RF signal passed through the antenna pattern, and a length of one side of the dielectric plate is set shorter than the wavelength. A metallic plate is coupled to the ground layer with a plurality of metallic spacers interposed therebetween, whereby the metallic plate is electrically connected to the ground layer.
申请公布号 US8866693(B2) 申请公布日期 2014.10.21
申请号 US201213547448 申请日期 2012.07.12
申请人 Omron Corporation 发明人 Nogami Hidekatsu
分类号 H01Q1/48;H01Q1/38;H01Q9/04 主分类号 H01Q1/48
代理机构 Eckert Seamans Cherin & Mellott, LLC 代理人 Milde, Jr. Karl F.;Eckert Seamans Cherin & Mellott, LLC
主权项 1. An antenna device comprising: an antenna board comprising: a dielectric plate having a first surface and a second surface; an antenna pattern in or on the first surface of the dielectric plate; and a ground layer formed in or on the second surface of the dielectric plate; a metallic plate disposed facing the ground layer of the antenna board; and a plurality of metallic spacers connecting the ground layer of the antenna board to the metallic plate, wherein a feed pin is disposed through the ground layer and the dielectric plate to feed electric power or a signal to the antenna pattern; wherein the metallic plate and the ground layer are coupled and electrically connected through the plurality of metallic spacers; wherein a first conductor pattern is formed in a predetermined area including a connection point to the feed pin while separated from the ground layer in the ground-layer forming surface of the antenna board, a second conductor pattern is formed near the first conductor pattern while separated from first conductor pattern and the ground layer, wherein the first and second conductor patterns are connected in series through a capacitor; and wherein a coaxial cable is inserted in a gap between the antenna board and the metallic plate, and an inner conductor of the coaxial cable is connected to the second conductor pattern while an outer conductor of the coaxial cable is connected to the ground layer.
地址 Kyoto JP