| 发明名称 | Bonded system with coated copper conductor | ||
| 摘要 | A semiconductor component includes a semiconductor die and a copper-containing electrical conductor. The semiconductor die has a semiconductor device region, an aluminum-containing metal layer on the semiconductor device region, and at least one additional metal layer on the aluminum-containing metal layer which is harder than the aluminum-containing metal layer. The copper-containing electrical conductor is bonded to the at least one additional metal layer of the semiconductor die via an electrically conductive coating of the copper-containing electrical conductor which is softer than the copper of the copper-containing electrical conductor. | ||
| 申请公布号 | US8866298(B2) | 申请公布日期 | 2014.10.21 |
| 申请号 | US201313739351 | 申请日期 | 2013.01.11 |
| 申请人 | Infineon Technologies AG | 发明人 | Bayerer Reinhold |
| 分类号 | H01L23/48;H01L21/44;H01L23/00 | 主分类号 | H01L23/48 |
| 代理机构 | Murphy, Bilak & Homiller, PLLC | 代理人 | Murphy, Bilak & Homiller, PLLC |
| 主权项 | 1. A semiconductor component, comprising: a semiconductor die having a semiconductor device region, an aluminum-containing metal layer on the semiconductor device region, and at least one additional metal layer on the aluminum-containing metal layer which is harder than the aluminum-containing metal layer; and a copper-containing electrical conductor bonded to the at least one additional metal layer of the semiconductor die via an electrically conductive coating of the copper-containing electrical conductor which is softer than the copper of the copper-containing electrical conductor. | ||
| 地址 | Neubiberg DE | ||