发明名称 Method of forming a phase change material layer pattern and method of manufacturing a phase change memory device
摘要 A method of forming a phase change material layer pattern includes forming a phase change material layer partially filling an opening through an insulating interlayer. A plasma treatment process is performed on the phase change material layer to remove an oxide layer on a surface of the phase change material layer. A heat treatment process is performed on the phase change material layer to remove a void or a seam in the phase change material layer, sufficiently filling the opening.
申请公布号 US8865558(B2) 申请公布日期 2014.10.21
申请号 US201213543905 申请日期 2012.07.09
申请人 Samsung Electronics Co., Ltd. 发明人 Park Jeong-Hee;Park Soon-Oh;Park Jung-Hwan;Oh Jin-Ho
分类号 H01L47/00;H01L45/00 主分类号 H01L47/00
代理机构 Volentine & Whitt, PLLC 代理人 Volentine & Whitt, PLLC
主权项 1. A method of forming a phase change material layer pattern, comprising: forming a phase change material layer on an insulating interlayer having an opening therein, in a process by which phase change material is formed in part of the opening, and wherein a native oxide is produced at a surface of the phase change material layer; removing the native oxide by performing a plasma treatment process on the phase change material layer; and performing a heat treatment process that comprises heating the phase change material layer, with the oxide having been removed from the surface thereof, to remove any void or a seam in the phase change material layer, such that the phase change material layer fills the opening more completely.
地址 Suwon-si, Gyeonggi-do KR