发明名称 |
Method of forming a phase change material layer pattern and method of manufacturing a phase change memory device |
摘要 |
A method of forming a phase change material layer pattern includes forming a phase change material layer partially filling an opening through an insulating interlayer. A plasma treatment process is performed on the phase change material layer to remove an oxide layer on a surface of the phase change material layer. A heat treatment process is performed on the phase change material layer to remove a void or a seam in the phase change material layer, sufficiently filling the opening. |
申请公布号 |
US8865558(B2) |
申请公布日期 |
2014.10.21 |
申请号 |
US201213543905 |
申请日期 |
2012.07.09 |
申请人 |
Samsung Electronics Co., Ltd. |
发明人 |
Park Jeong-Hee;Park Soon-Oh;Park Jung-Hwan;Oh Jin-Ho |
分类号 |
H01L47/00;H01L45/00 |
主分类号 |
H01L47/00 |
代理机构 |
Volentine & Whitt, PLLC |
代理人 |
Volentine & Whitt, PLLC |
主权项 |
1. A method of forming a phase change material layer pattern, comprising:
forming a phase change material layer on an insulating interlayer having an opening therein, in a process by which phase change material is formed in part of the opening, and wherein a native oxide is produced at a surface of the phase change material layer; removing the native oxide by performing a plasma treatment process on the phase change material layer; and performing a heat treatment process that comprises heating the phase change material layer, with the oxide having been removed from the surface thereof, to remove any void or a seam in the phase change material layer, such that the phase change material layer fills the opening more completely. |
地址 |
Suwon-si, Gyeonggi-do KR |