Light emitting device package and manufacturing method thereof

摘要

A light emitting device (LED) package and a manufacturing method thereof are provided. The LED package includes a circuit board comprising at least one device region, a plurality of electrode regions, at least one first thermal via exposed through upper and lower surfaces of the at least one device region, and a plurality of second thermal vias exposed through upper and lower surfaces of the plurality of electrode regions; at least one first thermal pad bonded to the upper surface of the at least one device region and connected to the first thermal via; at least one LED mounted on the at least one first thermal pad; a plurality of first electrode pads bonded to the upper surface of the electrode region and connected to the second thermal vias; and a plurality of wires to connect the at least one LED with the plurality of first electrode pads.

主权项

1. A light emitting device (LED) package comprising:
a circuit board comprising at least one device region, a plurality of electrode regions, a plurality of first thermal vias exposed through an upper surface and a lower surface of the at least one device region, and a plurality of second thermal vias exposed through upper surfaces and lower surfaces of the plurality of electrode regions; at least one first thermal pad bonded to the upper surface of the at least one device region and connected to the plurality of first thermal vias; at least one LED mounted on the at least one first thermal pad; a phosphor layer disposed on the at least one LED; a molding unit disposed on the phosphor layer; a plurality of first electrode pads bonded to the upper surface of the electrode region and connected to the plurality of second thermal vias; a plurality of wires to electrically connect the at least one LED with the plurality of first electrode pads, and a reflection metal layer coating a surface of the at least one first thermal pad, wherein the at least one LED overlies at least one of the first thermal vias, the phosphor layer surrounds the at least one LED and overlies the first thermal pad, and the phosphor layer does not overlie the first electrode pads, the circuit board is selected from an FR1 substrate, FR2 substrate, FR3 substrate, and FR4 substrate, and the reflection metal layer has thickness in the range of about 0.1 mm to 30 mm.