Circuit board and process for producing the same

摘要

The invention includes: applying an anisotropic conductive resin including conductive particles only to a plurality of bumps of an electronic component; placing the electronic component above a main surface of a flexible wiring board via the anisotropic conductive resin; and pressurizing the electronic component to the wiring board and curing the anisotropic conductive resin applied to the plurality of bumps to join the plurality of bumps to the electrodes of the wiring board. This can prevent a defective mounting of the electronic component.

主权项

1. A circuit board comprising:
a flexible wiring board; an electronic component mounted on a main surface of the wiring board via a plurality of bumps; first resin layers that are made of anisotropic conductive resin including conductive particles and that individually cover the plurality of bumps; and a second resin layer that fixes the electronic component and the wiring board, wherein the wiring board between the plurality of bumps is deformed and brought closer to the electronic component.