Method of fabricating a microcircuit device

摘要

A fabrication method for a device having a body having a cavity of dimensions suitable for receiving a module having a microcircuit, the cavity having a bottom and a peripheral wall surrounding the bottom, the method including a step of putting the module into place in the cavity. More precisely, the method comprises, prior to the step of putting the module into place, a step of depositing an adhesive strip at least on a surface of the module that is designed to face the bottom of the cavity, the adhesive strip being suitable for enabling the module to adhere at least to the bottom of the cavity and for limiting a deformation stroke of the module that could occur under the effect of a mechanical compression force urging the module against the bottom of the cavity.

主权项

1. A method of fabricating a device having a microcircuit, comprising
providing a device having a body with a cavity of dimensions suitable for receiving a module having a microcircuit, the cavity having a bottom and a peripheral wall surrounding the bottom, the peripheral wall comprising a step structure defining a bearing surface for the module once the module is in place; depositing an adhesive strip at least on a surface of the module that faces the bottom of the cavity; and subsequently putting the module into place in the cavity, wherein the adhesive strip is deposited to adhere to a surface of the module that faces the step structure defining a bearing surface and to adhere to the surface of the module that is designed to face the bottom of the cavity, and wherein putting the module into place includes fixing the module to the step structure defining a bearing surface through the adhesive strip.