Dissipation utilizing flow of refrigerant

摘要

Technologies are generally described for devices, methods, and programs for heat dissipating utilizing flow of refrigerant. An example heat dissipating device includes a conductive chamber to receive a fluid refrigerant, and the conductive chamber itself includes an evaporation portion having an interior layer and an exterior layer that is in contact with a heat generating unit, a condensation portion, and a rotatable brush that is configured inside of the conductive chamber to have an axis that is parallel to the interior layer of the evaporation portion and that is further configured to sweep across the interior layer of the evaporation portion to form a thin film of the fluid refrigerant.

主权项

1. A heat dissipating device, comprising:
a conductive chamber to receive therein a fluid refrigerant, the conductive chamber including:
an evaporation portion having an upper layer and a lower layer that is in contact with a heat generating unit, anda condensation portion; a rotatable brush that is configured inside of the conductive chamber to have an axis that is parallel to the upper layer of the evaporation portion and that is further configured to sweep across the upper layer of the evaporation portion to form a thin film of the fluid refrigerant, wherein the rotatable brush includes: at least two wheels,
wherein at least one of the at least two wheels is configured to be a driving wheel, andwherein further an axis of each of the at least two wheels is configured to be parallel to each other and to the upper layer of the evaporation portion; anda belt that is configured to have an under layer pass over an exterior surface of the at least two wheels and that is further configured to have a top layer that has one or more brush elements attached thereto.