Frame interconnect for concentrated photovoltaic module

摘要

In accordance with the present invention, there is provided multiple embodiments of a concentrated photovoltaic (CPV) receiver package or module which includes a uniquely configured frame interconnect to facilitate the electrical connection of a receiver die of the CPV module to the conductive pattern of an underlying substrate thereof. In each embodiment of the present invention, a single piece of sheet metal is bent to form features to fit over the bus bar on the receiver die and bond pads of the conductive pattern on the substrate. Electrical connections can be made by soldering or conductive paste attach. Elevated, flat areas between connections facilitates vacuum pick up and automatic assembly and provides high potential insulation between connects. Additionally, in each embodiment of the present invention, the piece of bent sheet metal used to form the frame interconnect of the CPV module includes a solderable surface finish, and defines a window to accommodate an optical prism or other light guide for concentrating solar rays.

主权项

1. A concentrated photovoltaic (CPV) module, comprising:
a substrate having a conductive pattern disposed thereon; a receiver die having a top surface including a pair of bus bars disposed on the top surface thereof, and an opposed bottom surface mounted to and electrically connected to a prescribed portion of the conductive pattern; and a frame interconnect comprising a single piece of material and including: a main body portion disposed above the receiver die and including a window formed therein and in which a portion of the receiver die is exposed; a pair of inner contact portions extending generally downward from the main body portion toward the receiver die and directly attached to respective ones of the bus bars of the receiver die; and a pair of outer contact portions extending generally downward from the main body portion toward the substrate, wherein the pair of outer contact portions are directly attached to respective prescribed portions of the conductive pattern of the substrate.