发明名称 Post deposition adjustment of chalcogenide composition in chalcogenide containing semiconductors
摘要 The concentration of a constituent within a chalcogenide film used to form a chalcogenide containing semiconductor may be adjusted post deposition by reacting the chalcogenide film with a material in contact with the chalcogenide film. For example, a chalcogenide film containing tellurium may be coated with a titanium layer. Upon the application of heat, the titanium may react with the tellurium to a controlled extent to reduce the concentration of tellurium in the chalcogenide film.
申请公布号 US8865514(B2) 申请公布日期 2014.10.21
申请号 US201012942132 申请日期 2010.11.09
申请人 Micron Technology, Inc. 发明人 Erbetta Davide;Bresolin Camillo;Rossini Silvia
分类号 H01L21/00 主分类号 H01L21/00
代理机构 Dorsey & Whitney LLP 代理人 Dorsey & Whitney LLP
主权项 1. A method, comprising: depositing a chalcogenide film on a first electrode, wherein a portion of the chalcogenide film contacts the first electrode, wherein the first electrode includes titanium nitride; depositing a titanium film over the chalcogenide film; depositing a second electrode on the titanium film, wherein the second electrode includes titanium nitride; and altering, the composition of the chalcogenide film.
地址 Boise ID US