发明名称 |
Post deposition adjustment of chalcogenide composition in chalcogenide containing semiconductors |
摘要 |
The concentration of a constituent within a chalcogenide film used to form a chalcogenide containing semiconductor may be adjusted post deposition by reacting the chalcogenide film with a material in contact with the chalcogenide film. For example, a chalcogenide film containing tellurium may be coated with a titanium layer. Upon the application of heat, the titanium may react with the tellurium to a controlled extent to reduce the concentration of tellurium in the chalcogenide film. |
申请公布号 |
US8865514(B2) |
申请公布日期 |
2014.10.21 |
申请号 |
US201012942132 |
申请日期 |
2010.11.09 |
申请人 |
Micron Technology, Inc. |
发明人 |
Erbetta Davide;Bresolin Camillo;Rossini Silvia |
分类号 |
H01L21/00 |
主分类号 |
H01L21/00 |
代理机构 |
Dorsey & Whitney LLP |
代理人 |
Dorsey & Whitney LLP |
主权项 |
1. A method, comprising:
depositing a chalcogenide film on a first electrode, wherein a portion of the chalcogenide film contacts the first electrode, wherein the first electrode includes titanium nitride; depositing a titanium film over the chalcogenide film; depositing a second electrode on the titanium film, wherein the second electrode includes titanium nitride; and altering, the composition of the chalcogenide film. |
地址 |
Boise ID US |