| 发明名称 | Method for manufacturing circuit board and method for manufacturing structure using the same | ||
| 摘要 | According to one embodiment of the invention, a method for manufacturing a circuit board comprises covering with a metal layer a surface of a first resin layer including polyimide resin; forming a plurality of conductive layers arranged on the metal layer with the conductive layers apart from each other in a planer view; roughening surfaces of the conductive layers with an alkaline aqueous solution; and etching a part of the metal layer between the conductive layers in the planer view to expose the surface of the first resin layer after roughening the surfaces of the conductive layers. | ||
| 申请公布号 | US8863377(B2) | 申请公布日期 | 2014.10.21 |
| 申请号 | US201113094991 | 申请日期 | 2011.04.27 |
| 申请人 | Kyocera Corporation | 发明人 | Harazono Masaaki;Umemoto Takayuki |
| 分类号 | H05K3/02;H05K3/10;H05K3/46 | 主分类号 | H05K3/02 |
| 代理机构 | Volpe and Koenig, P.C. | 代理人 | Volpe and Koenig, P.C. |
| 主权项 | 1. A method for manufacturing a circuit board comprising: covering a surface of a first resin layer including polyimide resin with a metal layer; forming a plurality of conductive layers arranged apart from each other in a planer view on the metal layer; roughening surfaces of the conductive layers with an alkaline aqueous solution; and etching a part of the metal layer between the conductive layers in the planer view to expose the surface of the first resin layer after roughening the surfaces of the conductive layers. | ||
| 地址 | Kyoto JP | ||