| 摘要 |
<p>The present invention relates to a multichip package including multiple semiconductor chips. As a multichip package including multiple slices connected to each other by a through via, each of the slices receives a slice activation signal and the multichip package includes an input part outputting the slice activation signal to the through via in response to a corresponding slice ID, a first output part outputting a signal delivered through the through via to an internal circuit of the corresponding slice in response to the slice ID, and a second output pat controlling the delivery of the signal delivered through the through via to the internal circuit in response to an activation mode of the slices.</p> |
